PM54 Series - SMD Power Inductor
Packaging Speci?cations
178.0
(7.00)
DIA.
2.0 ± 0.5
(.079 ± .020)
18.4
(.724)
THICKNESS
21.0 ± 0.8
(.827 ± .031)
13.0 ± 0.5
(.512 ± .020)
DIA.
13.0 ± 0.5
(.512 ± .020)
DIA.
14.0
(.551)
50.0
(1.969)
4
0.10
(.004)
MAX.
EMBOSSED
CARRIER
EMBOSSED
CAVITY
END
(.157)
START
12
(.472)
8
4.9
(.315)
(.117)
NO COMPONENT
160
(6.299)
COMPONENTS
3200
(125.984)
NO COMPONENT
400
(15.748)
USER DIRECTION OF FEED
QTY: 1500 PCS. PER REEL
REV. 05/12
Speci?cations are subject to change without notice.
Customers should verify actual device performance in their speci?c applications.
DIMENSIONS:
MM
(INCHES)
相关PDF资料
PM7232S-1R0M-RC INDUCTOR POWER 1UH 20% SMD
PM7232S-1R5M-RC INDUCTOR SHIELDED PWR 1.5UH SMD
PM75-100K-RC INDUCTOR POWER 10UH 10% SMD
PME271MB6100KR30 CAP FILM 0.1UF 275VAC RADIAL
PRS11S-N20K-103B1 POT 10K OHM 11MM CARBON SMD
PS0030VT33273BL1 CAP CER 3300PF 3.5KV CHASSIS
PS0055BE82033BG1 CAP CER 82PF 5KV 5% CHASSIS
PS100-2B1AR10K POT 10K OHM SLIDE 100MM
相关代理商/技术参数
PM54-221K-RC 功能描述:固定电感器 220uH 10% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
PM5422C-FI 制造商:PMC-Sierra 功能描述:2X10G PACKET OVER OTN PHY - Bulk
PM54-270M 功能描述:固定电感器 27uH 20% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
PM54-270M-RC 功能描述:固定电感器 27uH 20% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
PM542CE 制造商:ARTESYN 制造商全称:Artesyn Technologies 功能描述:Single, dual and triple output 1 to 10.5 Watt AC/DC encapsulated modules
PM542D 制造商:未知厂家 制造商全称:未知厂家 功能描述:Analog IC
PM542DS 制造商:未知厂家 制造商全称:未知厂家 功能描述:Analog IC
PM542K 制造商:ARTESYN 制造商全称:Artesyn Technologies 功能描述:Single, dual and triple output 1 to 10.5 Watt AC/DC encapsulated modules